Method and apparatus for MEMS oscillator

ABSTRACT

A resonator includes a CMOS substrate having a first electrode and a second electrode. The CMOS substrate is configured to provide one or more control signals to the first electrode. The resonator also includes a resonator structure including a silicon material layer. The resonator structure is coupled to the CMOS substrate and configured to resonate in response to the one or more control signals.

CROSS-REFERENCES TO RELATED APPLICATIONS

The present application is a continuation of and claims priority to U.S.patent application Ser. No. 12/944,982, which is a division of U.S.patent application Ser. No. 11/950,373 filed on Dec. 4, 2007, whichclaims benefit under 35 U.S.C. §119(e) of U.S. Provisional PatentApplication No. 60/868,710, filed Dec. 5, 2006, the disclosures of whichare incorporated by reference herein in their entirety for all purposes.

BACKGROUND OF THE INVENTION

The present invention related generally to oscillators and resonators.In particular, the invention provides a method and apparatus forfabricating and operating a resonator coupled to a CMOS substrate. Moreparticularly, one or more single crystal silicon oscillator structuresare controlled by a CMOS substrate in an embodiment. In a specificembodiment, at least a portion of the resonator structure is fabricatedfrom a single crystal layer joined to the CMOS substrate through awafer-level layer transfer process. Other embodiments of the presentinvention have a much broader range of applicability.

Quartz resonators have been used for oscillators and/or sensing devices.For example, quartz resonators are widely used in oscillators found inwatches and other applications that benefit from small size, low cost,and ruggedness. A quartz resonator operates by resonating in response toa stimulus, which may be a physical event, such as acceleration, force,or pressure. Alternatively, the quartz resonator may resonate inresponse to an electrical signal, thereby acting as a frequency source.

In addition to quartz resonators, microelectromechanical systems (MEMS)have been utilized to fabricate structures implementing resonatordesigns. As an example, silicon materials, which are characterized byexcellent mechanical strength and high material quality, have been usedin various MEMS resonators. Silicon is an attractive material for MEMSresonators, not only due to its favorable material properties, but as aresult of benefits gained by leveraging existing semiconductorprocessing techniques. Based on processing techniques developed by theintegrated circuit industry, fabrication processes for silicon-basedMEMS resonators are generally well developed.

Despite the developments made in the field of MEMS resonators, there isa need in the art for improved methods and systems for silicon-basedresonators and oscillators.

SUMMARY OF THE INVENTION

According to the present invention, techniques for oscillators andresonators are provided. In particular, the invention provides a methodand apparatus for fabricating and operating a silicon-based resonatorcoupled to a CMOS substrate. More particularly, one or more singlecrystal silicon resonator structures are controlled by a CMOS substratein an embodiment. In a specific embodiment, at least a portion of theresonator structure is fabricated from a single crystal layer joined tothe CMOS substrate through a wafer-level layer transfer process. Otherembodiments of the present invention have a much broader range ofapplicability.

According to an embodiment of the present invention, a resonator isprovided. The resonator includes a CMOS substrate having a firstelectrode and a second electrode. The CMOS substrate is configured toprovide one or more control signals to the first electrode. Theresonator also includes a resonator structure including a siliconmaterial layer. The resonator structure is coupled to the CMOS substrateand configured to resonate in response to the one or more controlsignals.

According to another embodiment, a resonator system is provided. Theresonator system includes a CMOS substrate having a first electrodeadapted to provide a drive signal and a second electrode adapted toprovide a sense signal. The resonator system also includes a resonatorstructure coupled to the CMOS substrate. The resonator structureincludes a hinge mechanically coupled to the CMOS substrate and asilicon resonator including a single crystal silicon layer. The siliconresonator is mechanically coupled to the hinge. In a particularembodiment, the hinge includes the single crystal silicon layer.

According to yet another embodiment of the present invention, a methodof fabricating a resonator device is provided. The method includesproviding a CMOS substrate including at least one electrode and joininga resonator substrate to the CMOS substrate. The method also includesremoving a portion of the resonator substrate to provide a resonatorlayer and thereafter patterning the resonator layer to form theresonator. In a specific embodiment, the method further includesdepositing a dielectric layer on the CMOS substrate and performing a CMPprocess to form a bonding surface prior to joining the resonatorsubstrate to the CMOS substrate.

Numerous benefits are achieved using the present invention overconventional techniques. Some embodiments provide methods and systemsthat include one or more resonators with long lifetimes and highreliability. Other embodiments provide oscillator systems characterizedby high levels of accuracy. In a particular embodiment, a resonatorstructure is fabricated in a single crystal silicon layer formed usingwafer-level layer transfer processes. Depending upon the embodiment, oneor more of these benefits may exist. These and other benefits have beendescribed throughout the present specification and more particularlybelow. Various additional objects, features, and advantages of thepresent invention can be more fully appreciated with reference to thedetailed description and accompanying drawings that follow.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a simplified perspective illustration of a portion of a MEMSresonator according to an embodiment of the present invention;

FIG. 2 is a simplified perspective illustration of a silicon beamresonator according to an embodiment of the present invention;

FIG. 3A is a simplified illustration of a portion of the silicon beamresonator illustrated in FIG. 2 operating in a lateral resonant mode;

FIG. 3B is a simplified illustration of a portion of the silicon beamresonator illustrated in FIG. 2 operating in a vertical resonant mode;

FIG. 3C is a simplified illustration of a portion of the silicon beamresonator illustrated in FIG. 2 operating in a rotational resonant mode;

FIG. 4A-4L illustrate a simplified process flow for the fabrication of aMEMS resonator according to an embodiment of the present invention;

FIG. 5 is a simplified schematic illustration of a MEMS oscillatoraccording to an embodiment of the present invention; and

FIG. 6 is a simplified process flow for the fabrication of a MEMSresonator according to an embodiment of the present invention.

DETAILED DESCRIPTION OF SPECIFIC EMBODIMENTS

Embodiments of the present invention provide MEMS structures useful fortiming device applications. Combining MEMS technology with CMOScircuitry, it is possible to fabricate oscillator and resonatorstructures useful in a wide variety of applications. The examplesdescribed herein are provided merely for purposes of illustration andare not intended to limit embodiments of the present invention.

FIG. 1 is a simplified perspective illustration of a portion of a MEMSresonator according to an embodiment of the present invention. The MEMSresonator 100 includes a moveable structure 110 that is mechanicallycoupled to one or more flexible members 112. The moveable structure 110is mechanically responsive to electrical signals provided using driveelectrode 120. In turn, sense electrode 122 is electrically responsiveto mechanical vibrations of the moveable structure 110. Although notillustrated in FIG. 1, a CMOS substrate provides mechanical support forresonator structure 120. Moreover, the CMOS substrate provideselectrical inputs to the resonator structure as well as receiveselectrical outputs from the resonator structure. Additional discussionrelated to the CMOS substrate is provided throughout the presentspecification and more particularly below.

Although the thickness of the moveable member 110 and the flexiblemembers 112 is illustrated as less than the thickness of the electrodes120/122 in FIG. 1, this is not required by embodiments of the presentinvention. In particular embodiments described herein, the moveablemember 110, the flexible members, 112, and the electrodes 120/122 arefabricated from a single layer, thereby providing for structures havingthe same thickness. In other embodiments, additional layers that aredeposited or otherwise formed result in structures with differentthicknesses as appropriate to the particular applications. The shape ofthe moveable plate is illustrated as a circle merely by way of example.In other embodiments, other shapes are utilized as appropriate to theparticular oscillator application. One of ordinary skill in the artwould recognize many variations, modifications, and alternatives.

FIG. 2 is a simplified perspective illustration of a silicon beamresonator according to an embodiment of the present invention. Referringto FIG. 2, a number of resonator structures 210 are fabricated in one ormore layers of material 205. In the embodiment illustrated in FIG. 2,the resonator structure 210 is fabricated from silicon material (e.g.,single crystal silicon) with one or more conductive layers depositedthereon. The shape and dimensions of the resonator structure and thedistances between the resonator structure and other components providedin or on layer 205 are selected to provide for oscillations inpredetermined frequency ranges depending on the particular applications.Utilizing well-developed semiconductor processing techniques, highlevels of control over such structures and dimensions are readilyprovided and utilized in various embodiments of the present invention.Although drive and sense electrodes are not illustrated in FIG. 2, suchelectrodes are provided in or on layer 205 in order to provide forinteraction between the resonator structure 210.

FIG. 3A is a simplified illustration of a portion of the silicon beamresonator illustrated in FIG. 2 operating in a lateral resonant mode. Asillustrated in FIG. 3A, the moveable member oscillates in the plane ofthe layers forming first electrode 220, first electrode 222 and thesilicon beam resonator 210. Motion in this plane is illustrated by thehorizontal arrow between the silicon beam resonator and the secondelectrode 222. The electrodes 220 and 222, which may be drive and senseelectrodes, respectively, are electrically isolated from the siliconbeam resonator 210.

In an exemplary embodiment of the present invention, the thickness ofthe silicon resonator structure is about 0.2 μm, although otherembodiments utilize layers that are thicker or thinner depending on theparticular application. In a particular embodiment, the siliconresonator is fabricated from a layer of single crystal silicon asdescribed more fully below. The dimensions and shape of the singlecrystal silicon beam supported above the CMOS substrate 201 as well asthe gaps between various components are selected to provide apredetermined oscillatory behavior depending on the application. Theshape illustrated in FIGS. 2, 3A, 3B, and 3C is merely an example of apossible structure and is not intended to limit the scope of embodimentsof the present invention.

FIG. 3B is a simplified illustration of a portion of the silicon beamresonator illustrated in FIG. 2 operating in a vertical resonant mode.In the embodiment illustrated in FIG. 3B, electrode 230, which istypically the drive electrode, is positioned on or extends from surface201 in a position under the resonator structure 210. The electrode 230may be smaller in size than the resonator structure 210 or extendlaterally beyond the footprint of the resonator structure depending onthe particular design. This first electrode 230 enables a voltage to beestablished in a vertical direction and thereby provides for resonantvertical oscillation of the resonator structure as illustrated by thevertical arrow. The motion of the resonator structure can be sensedusing the electrode 232 and 234 as FIG. 3B as the motion of theresonator structure 210 in the vertical direction results in a change inthe capacitance across the gap between the electrodes 232 and 234 andthe resonator structure 210. One of ordinary skill in the art wouldrecognize many variations, modifications, and alternatives.

FIG. 3C is a simplified illustration of a portion of the silicon beamresonator illustrated in FIG. 2 operating in a rotational resonant mode.Electrodes 240 and 250, which are driven out of phase from each other,are used to drive the resonator structure 210 in a rotational mode(torsional mode) as illustrated by the curved arrows to the right of theresonator structure 210 in FIG. 3C. In other embodiments, the phase ofthe voltages on the electrodes 240 and 250 is selected to provide forthe desired rotational motion. Alternately attracting the sides of theresonator structure 210 toward or away from the drive electrodes, therotational motion of the resonator structure is sensed using electrodes242A and 242B. One of ordinary skill in the art would recognize manyvariations, modifications, and alternatives.

FIGS. 4A-4L illustrate a simplified process flow for the fabrication ofa MEMS resonator according to an embodiment of the present invention.The process illustrated in FIGS. 4A-4L is merely an example of a processflow and is not intended to limit the scope of embodiments of thepresent invention. Referring to FIG. 4A, a CMOS substrate 410 isprovided that includes a number of electrodes 412 disposed on a surfaceof the CMOS substrate. The electrodes are electrically connected toother circuitry (not shown) in the CMOS substrate. Other components ofthe CMOS substrate are not illustrated for purposes of clarity. In anembodiment, the CMOS substrate is a fully processed CMOS substrate. TheCMOS substrate may include both logic and memory. One of ordinary skillin the art would recognize many variations, modifications, andalternatives.

In FIG. 4A, CMOS substrate 410 is illustrated after a via formationprocess. The illustrated electrodes 412 may be formed using a lowtemperature (e.g., less than 350° C.) PVD metal deposition process.Generally, the electrodes 412 are fabricated as a multi-layer metalstack such as 1,000 Å of titanium nitride (TiN), 8,000 Å of aluminum,and another 1,000 Å of TiN. Of course, in alternative embodiments, othersuitable materials that conduct electricity and/or provide mechanicalsupport for additional layers are utilized to form the electrodes 412.Patterning using photolithography and etching processes are utilized topattern the electrodes 412 after deposition.

FIG. 4B illustrates the deposition and planarization of a dielectriclayer 420 on the CMOS substrate 410. The dielectric layer may be formedfrom silicon oxide, silicon nitride, silicon oxynitride, combinationsthereof, and the like. After deposition, the upper surface of thedielectric layer 420 may be planarized using, for example, a CMPprocess, to form a bonding surface characterized by a predeterminedsurface roughness. In an embodiment, the surface roughness is less than5 Å RMS.

In a particular embodiment, a high density plasma (HDP) insulatordeposition, planarization, and patterning process is utilized tofabricate the dielectric layer 420 illustrated in FIG. 4B. illustrated.In the illustrated embodiment, planarization is accomplished using achemical mechanical polishing (CMP) process, although this is notrequired by the present invention. In the embodiment illustrated in FIG.4B, the layer 420 is an oxide layer deposited using a low temperature(e.g., less than 350° C.) HDP process, although other layers thatprovide electrical insulation and mechanical support for additionallayers are utilized in alternative embodiments. The electrodes 412 areillustrated as before and are covered by the oxide layer during thedeposition process.

In an embodiment, layer 420 is fabricated from silicon oxide(Si_(x)O_(y), e.g., SiO₂) but this is not required by the presentinvention. Other suitable materials may be used within the scope of thepresent invention. For example, layers fabricated from silicon nitride(Si_(x)N_(y), e.g., Si₃N₄) are utilized in alternative embodiments. Inyet other embodiments, silicon oxynitride (SiON) is used to fabricatelayer 420. Moreover, polysilicon material, including amorphouspolysilicon, is utilized in yet another alternative embodiment accordingto the present invention. Combinations of such materials may be used toform a composite layer. Materials with suitable characteristics,including formation of a strong bond with underlying layers, goodadhesion to CMOS substrate 110, and mechanical rigidity, are acceptablesubstitutes for the silicon oxide material illustrated in FIG. 4B.

Moreover, in some embodiments of the present invention, the process usedto deposit the layer or layers from which layer 420 is fabricated isperformed in light of the structures associated with the devicesubstrate. For example, some CMOS circuitry may be adversely impacted byperforming high temperature deposition processes, as these hightemperature deposition processes may damage metals (e.g., aluminumreflow) or result in diffusion of junctions associated with the CMOScircuitry. Thus, in a particular embodiment of the present invention,low temperature deposition, patterning, and etching processes, such asprocesses performed at temperatures of less than 500° C., are used toform layer 420. In another specific embodiment, deposition, patterning,and etching processes performed at less than 500° C., are used to formlayer 420.

In a particular embodiment, layer 420, with a first predeterminedthickness, is deposited on CMOS substrate 410. In a specific embodiment,the first thickness is about 2 μm. In other embodiments, the firstthickness ranges from about 1.0 μm to about 3.0 μm. Of course, thethickness will depend on the particular applications. In some depositionprocesses, the upper surface of the deposited layer 420 is uniformacross the substrate, resulting in a planar surface. However, a planarsurface after deposition is not required by the present invention. In aparticular deposition process, the patterned nature of the electrodes412 results in the thickness of layer 420 varying as a function oflateral position, producing an upper surface that is not entirely flat.

To planarize the upper surface of the deposited layer 420, an optionalCMP step is performed in an embodiment of the present invention. Theresults produced by the CMP process are illustrated by the upper surfaceof layer 420 as shown in FIG. 4B in which the thickness of layer 420 isa second thickness less than the first thickness. During the CMPprocess, material is removed, resulting in a highly polished andplanarized layer of a second thickness. In a particular embodiment, theroot-mean-square (RMS) roughness of the planarized surface is less thanor equal to about 4 Å. As will be described below, the extremely smoothsurface produced during the CMP process facilitates substrate bonding asshown in FIG. 4E. In embodiments according to the present invention, thesecond thickness of layer 420 is about 0.8 μm. Alternatively, the secondthickness ranges from about 0.5 μm to about 2.5 μm in other embodiments.Of course, the thickness will depend upon the particular applications.

FIG. 4C illustrates the formation of cavity 430 in dielectric layer 420.The dimensions of the cavity are selected depending on the particularapplication as described more fully below. Referring to FIG. 4C, acavity 430 is formed in layer 420 using a patterning and materialremoval process, such as etching. The cavity 430 extends from the uppersurface of deposited layer 420 to the top of the CMOS substrate. Thedimensions of the cavity are selected to provide a rotation space forthe moveable portions of the MEMS resonator as described more fullybelow. Although not illustrated in FIG. 4C for purposes of clarity,additional cavities are formed at various portions of the CMOS substratefor other MEMS resonators fabricated using the same substrate.

The cavity 430 is characterized by a volume defined by the depth of thecavity, measured normal to the upper surface of layer 420 and thelateral area of the cavity. According to embodiments of the presentinvention, the surface area defined by the upper surface of layer 420 isgreater than the combined lateral area of the cavity 430. The greatersurface area provided by the upper surface of layer 420 compared to thelateral area of the cavity facilitates substrate bonding as discussed inrelation to FIG. 4E since the bonding area is greater than the unbondedarea. In a specific embodiment, the lateral area of the cavity is about25 μm² for every 100 μm² of the surface of layer 420. Thus, the lateralarea of the cavity ranges from a few percent to several tens of percentof the total original surface area of the upper surface of layer 420prior to formation of the cavity and the bonding area extends over themajority of the surface area of layer 420. The bonding yield after alayer transfer process, which is related to the bonding area, is high inembodiments of the present invention as a result of these area ratios.

As another part of the fabrication process, a silicon-on-insulator (SOI)wafer is brought into physical proximity to the CMOS substrate asillustrated in FIG. 4D. The SOI wafer illustrated in FIG. 4D includes asingle crystal silicon layer, an oxide layer, and a substrate layer. Inalternative embodiments, other SOI substrates, which may include animplantation layer or other separation layer, are utilized. SOIsubstrates suitable for use in embodiments described herein areavailable from Soitec of Bernin, France, Silicon Genesis, Corporation,of San Jose, Calif., or MEMC Electronic Materials, Inc., of St. Peters,Mo.

In embodiments of the present invention, the layer transfer processillustrated, in part, by FIG. 4D, provides for various thicknesses oflayer 440, depending on the particular applications. For example, forresonators that oscillate substantially in a direction perpendicular tothe plane of layer 440, thickness for layer 440 are provided rangingfrom about 1.0 μm to about 0.1 μm. For such thin layers, sufficientflexibility is provided for the resonator structure to oscillateperpendicular to the plane of layer 440 in response to actuation by thecorresponding electrode positioned lateral to or below the resonatorstructure. Another exemplary resonator structure utilizes resonatorstructures that oscillate in a direction substantially parallel to theplane of layer 440. For such exemplary resonators, thicknesses of layer440 typically range from about 1.0 μm to about 10.0 μm.

FIG. 4E illustrates a wafer bonding process in which the SOI wafer isbonded to the CMOS substrate. The bonding process in some embodiments isa low temperature process adapted to preserve the integrated circuits onthe CMOS substrate. As illustrated in FIG. 4E, the single crystalsilicon layer 440 of the SOI wafer is bonded to the upper portion of thedielectric layer 420 during the substrate bonding process. Additionalinformation related to the substrate bonding process is provided in U.S.Pat. No. 7,172,921, issued on Feb. 6, 2007, and entitled “Method andStructure for Forming an Integrated Spatial Light Modulator,” which iscommonly assigned and is hereby incorporated by reference for allpurposes.

Substrate bonding can occur using a variety of techniques. In a specificembodiment, the bonding occurs using a room temperature covalent bondingprocess that results in the formation of a chemical bond at the bondinginterface. Such low temperature bonding processes maintain thestructural and electrical integrity of the CMOS substrate. Each of thefaces is cleaned and activated, e.g., by plasma activation, wetprocessing, or the like. The activated surfaces are brought in contactwith each other to cause a sticking action. In some bonding processes,mechanical force is provided on each substrate structure to press thefaces together. In embodiments in which layer 440 is silicon and layer420 is silicon oxide, silicon bearing bonds are created between the twofaces. In alternative embodiments, an oxide layer is formed on the uppersurface of layer 420 prior to bonding to provide an oxide-oxide bondinterface. The upper surface of layer 420 is polished by a CMP processin one embodiment while the bonding surface of layer 440 is polished aswell, providing an extremely smooth surface that is conducive tocovalent bonding processes. According to embodiments of the presentinvention, no intermediate bonding material (e.g., epoxy) is utilizedduring the substrate bonding process. Of course, one of ordinary skillin the art would recognize many other variations, modifications, andalternatives.

According to embodiments of the present invention, bonding techniquesare utilized that provide interfaces characterized by a bondedarea/total area ratio of greater than 10%. For example, the bonded area,characterized by an adhesion test, is greater than 10% of the surfacearea of the upper surface of layer 420. In other embodiments, the bondedarea/total area ratio is greater than 50%. In yet other embodiments, thebonded area/total area ratio is greater than 80%. The increase in bondedarea as a function of the total interface area will result in a strongermechanical connection between the torsion spring hinge layer and thesupport structures coupled to the substrate.

As illustrated in FIG. 4E, a sealed cavity is formed in between the twosubstrates during the bonding process. As described more fullythroughout the present specification, the cavity 430, which waspreviously formed using a lithography and etching process during theprocess illustrated in FIG. 4C, provides space for rotation of variouselements of the MEMS resonator during operation. The CMOS substratedefines a lower bound of the cavity and the thickness of the oxide layer420 defines the height of the cavity. Thus, the separation distancebetween portions of the CMOS substrate and the layer 440 is defined bythe thickness of the dielectric layer 420.

According to some embodiments, a thin SOI substrate is used with adirect implant process used during a portion of the substrate bondingand thinning process. In some embodiments, no epitaxial process is used,providing lower cost and better uniformity for the single crystalsilicon layer. In other embodiments, in order to increase the thicknessof the single crystal silicon layer 440, epitaxial processes areutilized after the initial fabrication of the SOI wafer. Additionally,although FIG. 4D illustrates the use of an SOI wafer including a singlecrystal silicon layer 440, this is not required by embodiments of thepresent invention. For example, silicon layers including epitaxialpolysilicon are included within the scope of the present invention. Asdiscussed in relation to FIG. 4D, the thickness of layer 440, which mayinclude one or more sub-layers formed by epitaxy, sputtering, or otherdeposition processes, is determined, in part, by the applications forthe particular resonator. Accordingly, various thicknesses for layer 440are provided by embodiments of the present invention, resulting in aflexible layer transfer process that is readily scaled to provide layerthicknesses appropriate for a variety of different devices. One ofordinary skill in the art would recognize many variations,modifications, and alternatives.

FIG. 4F and FIG. 4G illustrate two stages of a lapping, grinding,etching, or other thinning process in which the upper portion of the SOIwafer is removed. During grinding, a thickness variation typicallyresults as illustrated in FIGS. 4F and 4G. In FIG. 4F, the thicknessvariation is associated with layer 444 and in FIG. 4G, the thicknessvariation is associated with layer 446. After the thinning processesillustrated in FIGS. 4F and 4G, the oxide layer 442 is exposed asillustrated in FIG. 4H. The removal of the portion of the SOI waferabove the oxide layer is completed using an etching process to exposethe single crystal silicon layer 440 in the embodiment illustrated inFIG. 4I. Other material removal processes are utilized to expose theoxide layer and/or the single crystal silicon layer in otherembodiments. One of ordinary skill in the art would recognize manyvariations, modifications, and alternatives. After the oxide layer isremoved as illustrated in FIG. 4I to expose the single crystal siliconlayer, additional fabrication processes can be used to fabricate theresonator structure as described more fully below.

In other embodiments, wafers other than SOI wafers are utilized toprovide a resonator layer (e.g., a single crystal silicon layer) bondedto a CMOS substrate as illustrated in FIG. 4I. For example, anotherprocess includes bonding a hydrogen-implanted silicon wafer to the CMOSsubstrate. A single crystal silicon layer is then cleaved from thesilicon wafer after the bonding process to form the structureillustrated in FIG. 4I. One of ordinary skill in the art would recognizemany variations, modifications, and alternatives.

Via holes are etched through the single crystal silicon layer and thedielectric layer as illustrated in FIG. 4J. A portion of the electrodes412 are exposed during this process. As shown in FIG. 4J, vias 450 a and450 b are etched to provide a path for electrical contact betweenvarious layers of the structure. For example, via 450 a is a viaproviding an electrical connection between the electrode 412 a and adrive electrode (not shown) that is fabricated in subsequent processingsteps. In a similar manner, via 450 b is a via providing an electricalconnection between electrode 412 b and a sense electrode (not shown).Additional description of the geometry and placement of the vias isprovided below. Generally a two-step etch process is utilized to etchthrough the silicon layer 440 and the dielectric layer 420, terminatingon the upper surface of the metal-4 layer forming the electrodes 412.The cross-sectional profile of the vias is generally tapered, with alarger area at the top of the via than at the bottom of the via.Utilizing such a tapered via, PVD processes provide a layer ofcontinuous material in subsequent deposition processes.

FIG. 4K illustrates the formation of a metal layer 454 (e.g., using adeposition process) to provide electrical contact between the uppersurface of the single crystal silicon layer and the electrodes. In someembodiments of the present invention, a low temperature (less than 350°C.) chemical vapor deposition (CVD) process is utilized to deposit aconformal titanium layer that provides via step coverage andelectrically connects the upper surface of the single crystal siliconlayer 440 and the electrodes 412. Thus, electrical connectivity betweenthe silicon and the electrode is provided. The metal layer 454 may befabricated from suitable conductive materials, including Al, Ti, TiN,TiW, combinations thereof, and the like. Other via plug formationprocesses are utilized in alternative embodiments to provide a structuresimilar to that illustrated in FIG. 4K. One of ordinary skill in the artwould recognize many variations, modifications, and alternatives.

In addition to the design illustrated in FIG. 4K, alternativeembodiments utilize doping of the silicon layer 440 to provide electrodefunctionality. Yet other alternative embodiments utilize a combinationof both doping and electrical contacts as illustrated in FIG. 4K.Accordingly, combinations of electrical conductors are utilized toconduct current from the metal electrodes 412 formed as part of the CMOSsubstrate and the electrodes 460 and 462.

FIG. 4L illustrates the patterning of the metal and silicon layers toform one or more electrode structures and one or more moveablestructures. Referring to FIG. 4L, a drive electrode 460 and a senseelectrode 462 are provided on either side of a moveable structure 464,which is mechanically coupled to the CMOS substrate using flexiblemembers (not shown). In order to fabricate the structures illustrated inFIG. 4L, portions of the wafer are masked using a lithography processand etched using an etching process appropriate for metal, silicon, anddielectric materials. Of course, other removal processes are includedwithin the scope of the present invention. According to embodiments ofthe present invention, the fabrication of the moveable structure 464from a single crystal silicon member provides numerous benefits,including high reliability.

In a particular embodiment of the present invention, the definition ofthe structures illustrated in FIG. 4L are separated into two or morelithography/etch processes. For example, a moveable structure definitionetch includes patterning using deep-ultraviolet (DUV) lithography thatprovides critical dimensions of about 0.18 μm while the drive and senseelectrode patterning etch includes patterning using i-line lithographythat provides critical dimensions of about 0.6 μm. In other embodiments,critical dimensions of about 0.1 μm are provided by the processing stepsutilized during fabrication. Thus, although illustrated as a singleprocess in FIG. 4L, multiple lithography and etching steps characterizedby different resolutions are utilized in some embodiments to reduceprocessing costs while providing desired uniformity and control.Utilizing these embodiments of the present invention, the gap 466between the moveable structure 464 and the electrodes 460/462 can befabricated depending on various factors including desired process time,desired critical dimension, and the like.

It should be noted that in some embodiments, the dimensions or gapsbetween the resonator structure and the electrodes (such as 466laterally and the thickness of the dielectric layer 420 vertically) aredetermined as a function of the resonant modes of operation of thevarious system components. For operation in resonant modes for which theresonator structure moves vertically, the vertical gap between theresonator structure and the electrodes is a predetermined valuedepending on the particular resonant system. Thus, the thickness of thevarious layers as well as the separation distance between layer 440 andthe CMOS substrate, which is a function of the thickness of dielectriclayer 420, is selected as part of the system design. In someapplications, this vertical gap is sub-micron, while in otherapplications, it may be up to several or tens of microns.

For operation in resonant modes for which the resonator structure moveslaterally (i.e., in a direction substantially parallel to layer 440),the dimensions of the gaps 466 between the electrodes and the resonantstructure measured in the plane of layer 440 are predetermined values toprovide for oscillation of the moveable member 440 in the horizontalplane as well as for processing tolerances. For this mode of in whichoscillation is parallel to layer 440, the gap 466 between the electrodesand the resonator structure is a predetermined value appropriate toprovide desired voltage and capacitance for driving the resonatorstructure at the desired resonant frequencies. As an example, in someapplications, the amplitude of the motion of the resonator structure inthe plane of layer 440 is on the order of the scale of nanometers. Thus,sub-micron gaps between the resonator structure and the ends of theelectrodes are appropriate for these applications.

It should be noted that in embodiments of the present invention, theCMOS structure is completed prior to fabrication of the MEMS resonatorstructures. Thus, the transistor layers in the CMOS substrate aredisposed underneath the electrodes, which are disposed between thetransistor layer and the resonator structure. The connection to the CMOSsubstrate is more easily performed than in some techniques in which CMOSelements are fabricated after the formation of the MEMS elements.

FIG. 5 is a simplified schematic illustration of a MEMS oscillatoraccording to an embodiment of the present invention. The MEMS oscillatorincludes a MEMS resonator, which includes CMOS substrate 510 andresonator structure 512. As described above, resonator structureincludes a moveable member (e.g., a moveable plate) coupled to the CMOSsubstrate through one or more springs or hinges as well as drive andsense electrodes, typically positioned on opposite sides of the moveablemember. In a particular embodiment, the springs/hinges and the moveablemember are all fabricated from a continuous piece of material providedby a silicon-containing layer.

Control signals provided by the CMOS substrate are electrically coupledto the drive electrode, which results in an oscillatory motion in themoveable structure. The motion of the moveable structure results, inturn, in an electrical signal at the sense electrode, which iselectrically connected to the CMOS substrate. The electrical signal atthe sense electrode is utilized to provide inputs to the PLL, which, inturn, is electrically coupled to the drive electrode. Thus, undercomputer control and/or utilizing inputs from the timing output clocksignal 530, control and feedback is provided through the PLL 520 tooperate the oscillator as appropriate to the particular applications.

FIG. 6 is a simplified process flow for the fabrication of a MEMSresonator according to an embodiment of the present invention. Themethod 600 of fabricating a resonator device includes providing a CMOSsubstrate including at least one electrode 610. Typically, the CMOSsubstrate includes logic, memory, and/or other elements. In embodimentsof the present invention, the fabrication of the CMOS substrate iscompleted prior to the fabrication processes described herein. Thus,embodiments of the present invention contrast with some techniques inwhich resonator structures are fabricated and then processing isperformed to provide the functionality associated with the CMOSsubstrate. Accordingly, as described throughout the presentspecification and more particularly below, embodiments of the presentinvention provide a single crystal silicon resonator coupled to acompleted CMOS substrate, with processing of the single crystal siliconresonator being performed in light of the circuitry present on thecompleted CMOS substrate.

A planarized dielectric layer is formed over or deposited on the CMOSsubstrate 612, typically utilizing a deposition process followed by aplanarization process such as CMP. The CMP process is used to form abonding surface that will be used in subsequently joining a resonatorsubstrate to the CMOS substrate. A plurality of cavities are formed inthe planarized dielectric layer 614 utilizing one or more lithographyprocesses. A resonator substrate is joined to the CMOS substrate using alayer transfer process 616. In an embodiment, the layer transfer processis a wafer-level layer transfer process. In order to protect circuitryfound on the CMOS substrate, the layer transfer process is performed inthis embodiment by using low temperature bonding processes, that is,temperatures that do not adversely impact the circuitry previouslyformed on the CMOS substrate.

In some embodiments, the resonator substrate is an SOI substrate and thelayer transfer process is performed utilizing the SOI substrate thatincludes a single crystal silicon layer. In other embodiments, the SOIsubstrate or wafer may include one or more epitaxial layers, therebyproviding for layers with predetermined thickness and composition. Asdescribed throughout the present specification, the flexibility providedby the layer transfer process enables the fabrication of resonatorstructures operable at various resonant frequencies as appropriate toparticular applications.

The method also includes removing a portion of the resonator substrateto provide a resonator layer 618 and patterning the resonator layer toform the resonator 620. As an example, removing a portion of theresonator substrate may include performing one or more processesincluding grinding, lapping, or other similar processes. As a result ofthese removal processes, a resonator layer is exposed for subsequentpatterning. For example, in an embodiment, an etch back process isperformed to expose a silicon layer present on the resonator substrate.

The above sequence of steps provides a method for fabricating aresonator device according to an embodiment of the present invention. Asshown, the method uses a combination of steps including a way of formingmovable micromechanical structures. Other alternatives can also beprovided where steps are added, one or more steps are removed, or one ormore steps are provided in a different sequence without departing fromthe scope of the claims herein. Further details of the present methodcan be found throughout the present specification.

While the present invention has been described with respect toparticular embodiments and specific examples thereof, it should beunderstood that other embodiments may fall within the spirit and scopeof the invention. The scope of the invention should, therefore, bedetermined with reference to the appended claims along with their fullscope of equivalents.

What is claimed is:
 1. A method of fabricating a resonator device, themethod comprising: providing a CMOS substrate including at least oneelectrode; joining a resonator substrate to the CMOS substrate; removinga portion of the resonator substrate after the joining to provide aresonator layer; and thereafter patterning the resonator layer to formthe resonator.
 2. The method of claim 1 wherein the CMOS substratecomprises at least logic.
 3. The method of claim 1 further comprising:depositing a dielectric layer on the CMOS substrate; and performing aCMP process to form a bonding surface prior to joining the resonatorsubstrate to the CMOS substrate.
 4. The method of claim 1 wherein theresonator substrate comprises a hydrogen-implanted silicon bearingsubstrate.
 5. The method of claim 1 wherein joining the resonatorsubstrate to the CMOS substrate comprises performing a room temperaturebonding process.
 6. The method of claim 1 wherein a ratio of bonded areato total area between the CMOS substrate and the resonator substrate isgreater than 10%.
 7. The method of claim 1 wherein a drive electrode anda sense electrode are provided on either side of the resonator.
 8. Themethod of claim 1 wherein joining the resonator substrate to the CMOSsubstrate comprises performing a wafer-level layer transfer process. 9.The method of claim 8 wherein the wafer-level layer transfer processcomprises a low temperature bonding process.
 10. The method of claim 1wherein removing a portion of the resonator substrate comprisesperforming at least a grinding process or a lapping process on theresonator substrate.
 11. The method of claim 10 further comprisingperforming an etch back process to expose a silicon layer present on theresonator substrate.
 12. A method comprising: providing a CMOS substratecomprising one or more electrodes; bonding a Silicon-on-Insulator (SOI)substrate to the CMOS substrate; removing a portion of the SOI substrateafter the bonding to form a resonator layer; and patterning theresonator layer to form a resonator.
 13. The method of claim 12 whereinpatterning the resonator layer to form the resonator comprises providingelectrical connection between the one or more electrodes and a singlecrystal silicon layer of the SOI substrate.
 14. The method of claim 12bonding the Silicon-on-Insulator (SOI) substrate to the CMOS substratecomprises performing a room temperature bonding process.
 15. The methodof claim 12 further comprising: depositing a dielectric layer on theCMOS substrate; and performing a CMP process to form a bonding surfaceprior to joining the SOI substrate to the CMOS substrate.
 16. The methodof claim 12 wherein a drive electrode and a sense electrode are providedon either side of the resonator.
 17. The method of claim 12 whereinbonding a Silicon-on-Insulator (SOI) substrate to the CMOS substratecomprises a covalent bonding process.
 18. The method of claim 12 whereina ratio of bonded area to total area between the CMOS substrate and theSOI substrate is greater than 50%.
 19. The method of claim 12 whereinbonding the SOI substrate to the CMOS substrate comprises performing awafer-level layer transfer process.